solder paste

Solder-paste printing plays an important in SMT production, and affects the quality of assemblies.

SMT生产工艺决定了电子产品的可靠性, 焊膏印刷质量的好坏是其关键因素之一.

The second section will introduce the new slide valve and its application in Solder Paste process.

第二部分介绍最新的滑动阀科技及其在点锡膏中的应用.

Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?

对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?

In 2003 TOP absorb the adhesive and solder paste by cooperation with UNITEK.

2003年拓普科技与德国UNITEK电化公司合作,引进生产各类电子专用胶粘剂和焊锡膏.

Familiar with lead-free solder paste and at least 3 years related sales experience.

熟悉无铅锡膏产品及市场,具备3年以上行业销售经验.

Polymer Stencil for high Quality and Speed Solder Paste Printing

适合高质量高速度印刷高聚物模版

The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用.

In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.

表面贴装, 钢网是锡膏正确重复印刷的要害.

In the solder ball test, the performance of solder paste printing was valued on the base of observing solder flux residue and solder ball in the every stage of solder paste printing.

在焊膏焊料球试验中，根据各个阶段焊膏焊料球周围助焊剂残留物和焊球两个方面的表现对焊膏印刷性能进行评价。

Solder ball test and solder paste wetting test had been done in the every stage of experiments of solder paste printing.

在焊膏印刷性能试验中的各个阶段，进行了焊膏焊料球试验和焊膏润湿试验。

Using tweezers, place the terminals of the unit on the solder paste print.

使用镊子, 把最终单位放到锡膏印上.

So study lead-free solder paste in the electronic application package is important.

因此研究无铅锡膏在电子封装中的应用具有重要意义。

Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏 、 丝印机 、 锡膏使用方法和印刷工艺过程将影响到印刷质量.

Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

Research of Evaluation on Printability of Solder Paste

焊膏可印刷性评价方法的研究

The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用.

Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing

内置无铅锡膏印刷机的检测算法研究

To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度, 锡膏在晶片焊盘过焊.

Using a manual or pneumatic dispensing device, apply the solder paste to the pads.

使用手动或气动刷锡设备把锡膏刷到焊盘上.

We should the adhibit of solder paste before screen printing by automatic machine or by hand.

我们在进行锡膏印刷前应对锡膏进行一定的检测.如果没有专用设备也可以用以下的方法检查一下.

Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

Effect of Solder Paste Volume on Reliability of CBGA Assemblies

焊膏厚度对CBGA组装板可靠性的影响

Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控?

Do not use any warming device to heat up the solder paste.

切忌用加热工具对焊接材料进行加热.

Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies.

焊膏印刷是SMT生产 中关键工序之一, 其控制直接影响着组装板的质量.